Although we don't believe in timing the market or panicking over market movements, we do like to keep an eye on big changes -- just in case they're material to our investing thesis.
What: Shares of Freescale (NYSE: FSL ) have skyrocketed today by upwards of 12% after the semiconductor specialist posted first-quarter earnings results.
So what: Revenue in the first quarter came in at $981 million, easily besting the $966.1 million that the Street forecast. By the time investors got to the bottom line, the $0.03 per-share adjusted loss looked a lot better than the $0.09 per-share adjusted loss that they were braced for. CEO Gregg Lowe said the company's efforts to improve its capital structure are paying off.
Now what: Freescale continues to pursue new market opportunities, while reallocating research and development investments, which is helping boost profitability. The company also provided guidance for the coming quarter, with sales expected to be in the range of $1 billion to $1.04 billion. Gross margin should expand sequentially by between 0.9% and 1.3%, compared to 40.6% in the just-closed quarter.
Hot Semiconductor Stocks For 2015: AT & S Austria Technologie & Systemtechnik AG (AUS)
AT & S Austria Technologie & Systemtechnik AG (AT&S) is an Austria-based company that is principally engaged in the production of printed circuit boards. The Company is divided into three core business units: Mobile Devices; Automotive, and Industrial. The Company�� product assortment ranges from single- and double-sided printed circuit boards to multilayer printed circuit boards. They are used as electromechanical linking elements, mainly in the telecommunication sector, automobile industry and medical technology applications, as well as defense and aerospace. AT&S operates production sites in Austria, India, China and Korea. It also maintains international sales offices, based in Austria, Ireland, Germany, the Czech Republic, France, Hungary and Belgium. As of March 31, 2011, the Company operated through its subsidiaries in India, Germany, Austria, China, Hong Kong, Japan, South Korea, Taiwan and the United States. Advisors' Opinion:- [By Triska Hamid]
Professors at the American University of Sharjah (AUS) are also looking at dental care with braces imbedded with a chip that monitor the movement of the fixtures and will communicate with the dentist's office if any of them are separated from the teeth.
Hot Semiconductor Stocks For 2015: Advanced Semiconductor Engineering Inc (ASX)
Advanced Semiconductor Engineering, Inc. is principally engaged in the manufacture, assembly, processing, testing and distribution of integrated circuits (ICs). The Company provides semiconductor packaging and testing services, including plastic leaded chip carriers (PLCCs), quad flat packages (QFPs) and flip chip packaging technology, among others, which are applied in the manufacture of household electrical appliances, communication devices, automobile components, personal computers, set top boxes, servers, memory integrated circuits (ICs), mobile phones, digital cameras, game consoles, projectors, high definition (HD) televisions, wireless communication network products and power management ICs, among others. The Company operates its businesses primarily in Taiwan, Europe and the Americas. In August 2010, the Company acquired a 100% interest in EEMS Test Singapore.
The Company is focused on packaging and testing logic semiconductors. The Company offers its customers turnkey services, which consist of packaging, testing and direct shipment of semiconductors to end users designated by its customers. The Company�� global base of over 200 customers includes semiconductor companies across a range of end use applications, including Altera Corporation, ATI Technologies, Inc., Broadcom Corporation, Cambridge Silicon Radio Limited and Microsoft Corporation. During the year ended December 31, 2008, the Company�� packaging revenues accounted for 77.7% of its net revenues and its testing revenues accounted for 20.1% of its net revenues.
Packaging Services
The Company offers a range of package types to meet the requirements of its customers, with a focus on packaging solutions. Within its portfolio of package types, the Company focuses on the packaging of semiconductors. These include advanced leadframe-based package types, such as quad flat package, thin quad flat package, bump chip carrier and quad flat no-lead package, and package types based on substrates, such a! s flip-chip ball grid array (BGA) and other BGA types, as well as other packages, such as wafer-bumping products. Leadframe-based packages are packaged by connecting the die, using wire bonders, to the leadframe with gold wire. The Company�� leadframe-based packages include quad flat package (QFP)/ thin quad flat package (TQFP), quad flat no-lead package (QFN)/microchip carrier (MCC), advanced quad flat no-lead package (AQFN), bump chip carrier (BCC), small outline plastic package (SOP)/thin small outline plastic package (TSOP), small outline plastic j-bend package (SOJ), plastic leaded chip carrier (PLCC) and plastic dual in-line package (PDIP). Substrate-based packages employ the BGA design, which utilizes a substrate rather than a leadframe. It also assembles system-in-a-package products, which involve the integration of more than one chip into the same package. The Company�� substrate-based packages include Plastic BGA, Cavity Down BGA, Stacked-Die BGA, Flip-Chip BGA and land grid array (LGA).
The Company�� wafer-level packaging products include wafer level chip scale package (aCSP) and advanced wafer level package (aWLP). The Company offers module assembly services, which combine one or more packaged semiconductors with other components in an integrated module to enable functionality, typically using surface mount technology (SMT) machines and other machinery and equipment for system-level assembly. End use applications for modules include cellular phones, personal digital assistant (PDAs), wireless local area network (LAN) applications, bluetooth applications, camera modules, automotive applications and toys.
The Company provides module assembly services primarily at its facilities in Korea for radio frequency and power amplifier modules used in wireless communications and automotive applications. Interconnect materials connect the input/output on the semiconductor dies to the printed circuit board. Interconnect materials include substrate, which is a multi-layer m! iniature ! printed circuit board. The Company produces substrates for use in its packaging operations.
Testing Services
The Company provides a range of semiconductor testing services, including front-end engineering testing, wafer probing, final testing of logic/mixed-signal/radio frequency (RF) and memory semiconductors and other test-related services. The Company provides front-end engineering testing services, including customized software development, electrical design validation, and reliability and failure analysis. The Company provides final testing services for a variety of memory products, such as static random access memory (SRAM), dynamic random access memory (DRAM), single-bit erasable programmable read-only memory semiconductors and flash memory semiconductors.
The Company provides a range of additional test-related services, including burn-in testing, module sip testing, dry pack, tape and reel, and electric interface board and mechanical test tool design. The Company offers drop shipment services for shipment of semiconductors directly to end users designated by its customers.
Advisors' Opinion:- [By Adam Haigh]
ASX Ltd. (ASX) posted the biggest weekly loss in 3 1/2 years, falling 6.1 percent to A$33.15, amid a A$553 million ($530 million) capital raising at the operator of Australia�� main stock exchange to ensure its clearing business complies with new regulations.
- [By Namitha Jagadeesh]
The FTSE 100 Index (UKX) fell 1.31 points, less than 0.1 percent, to 6,679.77 at 10:12 a.m. in London, trimming an earlier decline of as much as 0.6 percent. The gauge has climbed 13 percent this year as central banks maintained stimulus measures to support the global economy. The broader FTSE All-Share Index (ASX) was also little changed today, while Ireland�� ISEQ Index retreated 0.3 percent.
Top 5 Up And Coming Stocks To Invest In Right Now: Camtek Ltd (CAMT)
Camtek Ltd. (Camtek), incorporated in 1987, designs, develops, manufactures and markets automated solutions dedicated for enhancing production processes and yield for the semiconductor manufacturing and packaging and the printed circuit board (PCB) and integrated circuit (IC) substrate industries. Camtek also designs, develops, manufactures and markets automated optical inspection (AOI), systems and related products. The Company�� AOI systems are used to enhance both production processes and yields for manufacturers in the semiconductor manufacturing and packaging industry and PCB and IC Substrate industry. Through the acquisition of Printar's assets, it also engaged in developing, manufacturing, sale and marketing of direct digital material deposition systems and inks for the PCB industry, with two major fields of activity: Solder Mask and Legend. In addition, through the acquisition of Sela, it is also engaged in the development, manufacturing and marketing of automated scanning electron microscope (SEM) and transmission electron microscope (TEM) sample preparation equipment, primarily for the semiconductor industry.
As of December 31, 2011, the Company had sold more than 2,500 AOI systems in 34 countries worldwide. The Company's PCB customer base includes the majority of the 100 PCB manufacturers worldwide. As of December 31, 2011, it had sold over 300 Falcon systems to more than 25 semiconductor manufacturers, among them outsourced semiconductor assembly and test (OSAT), integrated device manufacturers (IDM) and wafer level packaging subcontractors, including eight out of the top 10 semiconductors companies.
Camtek�� AOI systems consist of an electro-optical assembly unit, either movable or fixed, which consists of a video camera, precision optics and illumination sources. The electro-optical unit captures the image of the inspected product; a precise, either movable or fixed table, that holds the inspected product, and an electronic hardware unit, which operates the! entire system and includes embedded components that process and analyze the captured image by using its algorithms. Its systems can also compile and communicate statistical reports of inspection findings through the customer�� factory information system. The Company offers a range of systems for automated optical inspection of semiconductor wafers, IC substrates and PCBs. These systems are used to enhance production yields and assist in controlling manufacturing processes at wafer fabrication, test and assembly houses, and PCB plants worldwide.
The Company�� Falcon systems are designed for the back end market of the semiconductor industry. The Falcon�� advanced algorithms and inspection capabilities enable its dedicated models to detect defects in the die, which, if left undetected, may cause failure. The Condor is designed to meet the current and future inspection needs of the semiconductor industry. The Condor, through algorithms and advanced hardware configuration, is designed to enhance two dimensional (2D) and three dimensional (3D) detection abilities and increased throughput. The Condor family includes models for: 3D and 2D metrology and inspection of bumped-wafer prepared for packaging in the flip-chip technology; 2D metrology and inspection of finished wafers at the end of their manufacturing process and in test houses; Post-dicing inspection of frame-mounted wafers at assembly and packaging facilities, where it adds the value of detecting dicing-related damage, and inspection and metrology of micro-electro mechanical systems (MEMS) and other special applications.
Condor 5LED is an AOI system designed to provide solutions to a range of requirements that are to light emitting diode (LED) semiconductor manufacturers. The LED market�� special inspection requirements are characterized by 3-6 inch wafers, each of which may contain between 100 to over 200 thousand LED devices per wafer. Typically, the wafer is made of a translucent compound semiconductor, such as g! allium ar! senide, gallium phosphide and/or indium phosphide. The Gannet system is designed for the front end market of the semiconductor industry.
The Company�� AOI products for this industry consist of five product lines: the Phoenix, Dragon and Orion for the inspection of inner and outer layers of PCB panels and ultra-fine-line IC substrate; large area masks (LAM) dedicated for inspection of artwork; and the Pegasus for final inspection (AFI) of IC substrates and high density interconnect (HDI) panels. The Phoenix product family, introduced in November 2011, is designed to support a range of the demanding PCB and IC substrate applications, while keeping in pace with the dynamic technology changes in the industry. The Phoenix product family is enhanced with Spark - Camtek's and detection engine providing high detection capabilities, while minimizing false calls.
Dragon systems are high-throughput, automation-ready systems for inspection of all PCB types in a mass production environment. Dragon models are optimized for specific PCB technology ranges - from mainstream circuits of typically 100 (microns) conductor line width, up to high density substrates having 12 (microns) wide conductive lines. All Dragon models are designed to interface with automated material handling mechanisms provided by the Company or other automation suppliers. Orion systems are stand-alone AOI systems for high volume inspection of all PCB types designed to operate in inspectify mode of operation. Inspectify is a mode of operation enabling the operator to perform verification immediately after inspection on the same system, thus saving time and eliminating handling-related defects.
LAM is specially designed for main-stream LAM inspection. It offers unparalleled detection ability on LAM with down to 25 (microns) line/space width technology. The LAM incorporates advanced technology innovations to ensure the level of detection that these masks require at this critical production stage. Camtek offers! various ! stand-alone verification systems that enable verification of panels after inspection. The Pegasus line includes systems for automated inspection of finished IC substrates that are subsequently used in packaging of ball grid array (BGA) and Chip Scale Package (CSP) devices. The Pegasus inspects both sides of the substrate, detecting process and mechanical defects, in particular in the gold-plated areas, where the substrate will interconnect with the silicon die or the PCB, and in the solder-mask areas. Pegasus models handle substrates in strip format in magazines.
GreenJet is a SM digital printing system aimed to replace the conventional SM application lines for prototypes and high mix low volume production. The GreenJet system offers manufacturers flexible and digital SM printing technology solution. The LGP system incorporates PCB digital legend printing technologies with specially developed heat curable ink, resulting in output and system performance. Camtek has developed the inks for both LGP and GreenJet, which involves different chemicals mixed together in order to reach the required ink characterization.
The Company competes with Rudolph Technologies Inc., KLA-Tencor Corporation, Topcon Corporation, Toray Industries, Inc., Hitachi Ltd., Nidec Tosok Corporation., FEI Company, SII Nanotechnology Japan, Carl Zeiss, Inc., Orbotech Ltd., Dainippon Screen Manufacturing Company, Lloyd-Doyle Limited, Gigavis Co. Ltd., ATI Electronics Pty Ltd., Shirai Electronics Industrial Co. Ltd., First EIE SA and MicroCraft K.K.
Advisors' Opinion:- [By James E. Brumley]
Investors who've made a point of keeping tabs on the 3D printing craze this year will know that a pair of small caps in this space - Camtek LTD (NASDAQ:CAMT) and Voxeljet AG (NYSE:VJET) - have dominated the headlines in just the past few weeks. For CAMT, the big news was the recent announcement that it would be the first 3D printer maker to develop a product that could print circuit boards. As for VJET, news that it was going to greatly expand its on-demand-printing capacity (for customers that need smaller occasional jobs but don't want to buy a printer of their own) lit the stock up quite nicely.
- [By James E. Brumley]
In retrospect, their pullbacks come as no real surprise. Neither Voxeljet AG (NYSE:VJET) nor Camtek LTD. (NASDAQ:CAMT) saw their shares soar on any news that was meaningfully sustainable, and after the "shoot first, ask questions later" market had a chance to start asking questions, it became clear that - even with the largest of glimmers of corporate progress unveiled a few weeks ago - CAMT and VJET both had been bid up more on hype and less on substance. Meanwhile (and this could be bitterly ironic to some), a small cap play in the same 3D printing space that (1) didn't beat the daylights out of its hype-drum, and (2) is actually much closer to bringing a revenue-bearing product to the market [per today's news - more on that below] isn't getting anywhere near the same attention. That company? Makism 3D Corp. (OTCBB:MDDD). The good news is, MDDD finally looks like it's revving its engine, while Camtek and Voxeljet AG shares continue to deteriorate.
- [By Paul Ausick]
Stocks on the Move: Ariad Pharmaceuticals Inc. (NASDAQ: ARIA) is up 35.7% at $5.13. Camtek Inc. (NASDAQ: CAMT) is up 71.7% at $4.55 after saying that a 3D printer is coming next year from the company. Sungy Mobile Ltd. (NASDAQ: GOMO) is up 28.8% at $17.19 after last Friday�� IPO. InterCloud Systems Inc. (NASDAQ: ICLD) is down 28.2% at $9.20.
- [By Paul Ausick]
Then there�� Camtek Ltd. (NASDAQ: CAMT) with a far more modest forward multiple of 17.6 as of today. But Camtek doesn’t have a 3D printer for sale yet, it only referred to a 3D printer during its November earnings conference call, saying that it was still too early for the company to estimate the impact of a planned 2014 introduction for its 3D printing device that will produce printed circuit boards (PCBs).
Hot Semiconductor Stocks For 2015: Aeroflex Holding Corp (ARX)
Aeroflex Holding Corp. (Aeroflex Holding) is a provider of radio frequency (RF) and microwave integrated circuits, components and systems used in the design, development and maintenance of wireless communication systems. The Company�� solutions include microelectronic components and test and measurement equipment used by companies in the space, avionics and defense; commercial wireless communications, and medical and other markets. Its products include a range of RF, microwave and millimeter wave microelectronic components, integrated circuits (ICs), and analog and mixed-signal devices. It also manufactures a range of RF and microwave wireless radio and avionics test equipment and solutions particularly for the wireless, avionics and radio test markets. The Company operates in two segments: Aeroflex Microelectronics Solutions (AMS) and Aeroflex Test Solutions (ATS). In August 2010, it acquired Advanced Control Components. In September 2013, the Company announced the sale of its Aeroflex Test Equipment Services (ATES) business to Trescal Limited. In February 2014, Aeroflex Holding Corp announced the acquisition of Shenick Network Systems.
Aeroflex Microelectronic Solutions
AMS offers a range of microelectronics products and is a provider of specialty products for the space, avionics, defense, commercial wireless communications, medical and other markets. RadHard products are specifically designed to tolerate high radiation level environments, which otherwise can degrade electronic components. The Company principally operates on a fabless semiconductor manufacturing model, outsourcing virtually all front-end semiconductor fabrication activities to commercial foundries. AMS offers a range of complementary products that provide connectivity and computing functionality for applications. Its product portfolio includes RF, microwave and millimeter wave products, including discrete components, ICs, monolithic microwave ICs and multi-chip modules.
AMS designs and manu! factures application specific, analog and mixed-signal devices for use in medical, industrial and intelligent sensors. The Company�� AMS products are used in over 100 space, avionics and defense platforms, including the Wideband Global Satellite Communications satellites, the Geostationary Operational Environmental satellites, the Advanced Extremely High Frequency satellites, the Boeing 777 airliner's databus, the F-16's modular mission computer, the B-1 flight controls upgrade and the Terminal High Altitude Area Defense program. Its AMS products are also used in wireless communications platforms, including WCDMA and LTE cellular base station systems, as well as point-to-point broadband radio applications. In the medical area, our products are used by two of the top four manufacturers of CT scan equipment.
AMS provides HiRel standard and custom integrated circuits and circuit card assembly for the aerospace, altitude avionics, medical, x-ray cargo scanners, critical transportation systems, nuclear power controls, global positioning systems (GPS) receivers, networking and telecommunication markets. AMS' HiRel products include transceivers, analog multiplexers, clock management generators, MSI logic products, battery electronics units, voltage regulators, high-speed power controllers, MIL-STD 1553 bus controllers, remote terminals, bus monitors, microcontrollers and microprocessors, RadHard Pulse Width Modulation Controllers, RadHard Resolver-to-Digital and memory modules. HiRel Microelectronics/ Semiconductors have a typical life cycle of 10-20 years.
AMS provides a set of standard and application specific RF/microwave diodes and semiconductor devices. Microwave semiconductor products offered include diodes, amplifiers, resistors, inductors, capacitors, switches, and integrated devices. RF and Microwave active components and subsystems offered include PIN diode-based microwave control components, variable attenuators, phase shifters, limiters, time delay units and Multi-Funct! ion Micro! wave assemblies. AMS offers resistor products, which include a variety of low and high reliability power surface mounted passive devices for the wireless infrastructure and defense markets with applications in isolators, circulators, single and multi-carrier power amplifiers and circuits. Passive components offered include attenuators, terminations, adapters, DC blocks, and other components for commercial, military and laboratory applications. Other products include power amplifiers, up and down converters, mixers, filters and micro-receivers operating to over 40 giga hertz (GHz). RF and Microwave components have a typical life cycle of 5-15 years. The Company�� motion control products provide complete and integrated motion control solutions for space (both military and commercial), military, avionics, and industrial customers. Its product line offerings include actuators and mechanisms, electronic controllers, slip rings and twist capsules, DC motors and Gimbal Systems. Motion control products have a typical life cycle of 10-20 years.
Aeroflex Test Solutions
ATS is a provider of a line of specialized test and measurement hardware and software products, primarily for the space, avionics, defense, commercial wireless communications and other markets. ATS products and their applications include wireless test equipment, which is used to develop and test handsets and base stations; military radio and PMR test equipment, which is used by radio manufacturers and military, police, fire, and emergency response units to test handheld radios; avionics test equipment, which is used in the design, manufacture and maintenance of electronics systems for aircraft; synthetic test equipment, which is used to test satellites and transmit / receive modules prior to launch and deployment, and general purpose test equipment, including spectrum analyzers and signal generators.
Wireless Test Equipment is used by wireless service providers and equipment manufacturers to test wireless ! handsets ! and base stations. The Company offers a range of cellular tests across a range of wireless standards and communication frequencies, including 2G and 3G, with particular capability in EDGE protocols, and the new 4G LTE/LTE(A) protocols. Products include a range of system, protocol, physical layer and parametric test solutions, such as the TM500 test mobile, RF synthesizers, digitizers and combiners, and application software. In addition, ATS provides PXI-based products which are modular scalable solutions for the handset manufacturing environment. Product applications include research and development, conformance, manufacturing/production, installation and commissioning, field service, and network optimization.
ATS Radio Test Equipment is used by radio manufacturers and military, police, fire and emergency response units to test handheld radio units. ATS provides TErrestrial Trunked Radio (TETRA), and Project 25 (P25), radio test equipment, addressing both mobile and repeater test applications. TETRA is a global standard for private mobile radio (PMR), systems used by emergency services, public transport and utilities. P25 is a standard for digital radio communications for use by federal, state, private, and local public safety agencies in North America. Its military communications testing systems are primarily used by the United States military to test complex voice and data frequency hopping radios and accessories. Military radio and PMR test equipment has a typical life cycle of 5-20 years.
Avionics test equipment is used in the design, manufacture, test and maintenance of commercial, civil and military airborne electronic systems, or avionics. ATS equipment provides the stimulus and signals necessary for certification, verification, fault finding and diagnosis of airborne systems on the ground. For civil and commercial aviation, it has test solutions for various transponder modes, communications frequencies, emergency locator transmitters, weather radars and GPS systems. F! or milita! ry aviation, it has test solutions for microwave landing systems, tactical air navigation, enhanced traffic alert and collision avoidance systems, various identification friend or foe, or IFF, transponder/interrogator modes and IFF monopulse antenna simulation. ATS also provides customized avionics test solutions to support manual and automatic test equipment for manufacturing, repair and ground support operations. Avionics test equipment has a typical life cycle of 8-15 years.
Synthetic test systems test several attributes through one box and can take multiple complex measurements simultaneously. ATS provides synthetic test environment that allows digital, analog, RF/microwave and power test of circuits, modules, subsystems and complete systems for commercial, military, and aerospace customers. ATS' STI 1000C+ and TRM 1000C products offer synthetic microwave test systems optimized for testing Transmit/Receive modules and satellite payloads in a factory setting. Its SMART^E and SMART^E 5300 products offer a modular approach for implementing multi-function configurable and reconfigurable test systems. Synthetic test solutions products have a typical life cycle of 10-15 years.
ATS offers a variety of general purpose test solutions including microwave test solutions, counters and power meters. ATS microwave test solutions cover frequency ranges from 1 megahertz (MHz) to 46 gigahertz (GHz), with various tracking, offset, continuous wave, modulated source, fault location, and group delay configuration options provided. ATS power meters are designed for field use, automated test equipment requirements and standard bench applications. General purpose test solutions have a typical life cycle of 4-7 years.
The Company Competes with Agilent Technologies, Honeywell, BAE Systems, Hittite Microwave Corporation, ILC / Data Devices Corporation, Microsemi, Anaren, Anite, Anritsu, Rohde & Schwarz, Spirent and National Instruments.
Advisors' Opinion:- [By Jake L'Ecuyer]
Leading and Lagging Sectors
In trading on Tuesday, technology shares were relative leaders, up on the day by about 0.12 percent. Leading the sector was strength from Aeroflex Holding (NYSE: ARX) and Canadian Solar (NASDAQ: CSIQ). Cyclical consumer goods & services shares declined around 0.71 percent in Tuesday's trading. - [By Rich Smith]
The Department of Defense issued some 22 separate contract awards Thursday, totaling just under $1 billion in combined value. Not all of them went to publicly traded defense contractors, of course, but enough of them did to be worth mentioning. Here are a few of the lucky winners:
Hot Semiconductor Stocks For 2015: GigOptix Inc (GIG)
GigOptix, Inc. (GigOptix), incorporated on March 2008, is a supplier of semiconductor and electro-optical component products that enables high-speed end to end data streaming over optical fiber and wireless telecommunications and data-communications networks globally. The Company's products convert signals between electrical and optical formats for transmitting and receiving data over fiber optic networks and between electrical and high speed radio frequencies to enable the transmission and receipt of data over wireless networks. The Company is creating both optical telecommunications and data-communications applications for fast growing markets in 10 giga bytes per second (Gbps), 40Gbps and 100Gbps drivers, receiver integrated circuits (IC), electro-optic modulator components and multi-chip-modules (MCM), as well as E-band wireless data-communications applications for high speed mobile backhaul and other high capacity wireless data transport applications. During the year ended December 31, 2011, the Company shipped over 150 products to over 200 customers.
The Company offers a portfolio of 10Gbps and 40Gbps electro-optical products and is developing market for 100Gbps products. The Company provides bundled solutions that consist of a few of its products, such as modulator and driver. The Company also offers a comprehensive portfolio of Monolithic Microwave Integrated Circuit (MMIC) and application-specific integrated circuit (ASIC) products to support E-band wireless communication and defense markets. The Company has also developed 10Gbps vertical cavity surface-emitting laser (VCSEL) drivers and receivers for aerospace as well as outdoor, non-temperature controlled environments that enables higher capacity in its customers' next generation flight and data center systems.
The Company has a portfolio of products for telecommunications , data-communications, defenses and industrial applications designed for optical speeds from 3Gbps to over 100Gbps and for wireless frequencies! from zero giga hertz (GHz) to 86GHz. The Company's products support a range of data rates, protocols, transmission distances and industry standards.
The Company's portfolio consists of the product ranges, such as laser and modulator drivers for 10Gbps, 40Gbps and 100Gbps applications; receiver amplifiers or Trans-impedance Amplifiers (TIAs) for 10Gbps, 40Gbps and 100Gbps applications; VCSEL driver and receiver chipsets for 14 and 12 channel parallel optics applications from 3Gbps to 10Gbps; Electro-optic modulators based on the Company's TFPS technology suitable for various 40Gbps and 100Gbps modulation schemes, such as differential phase shift keying (DPSK), differential quadrature phase shift keying (DQPSK), RZ-DQPSK and DP-QPSK; wideband monolithic microwave integrated circuit (MMIC) amplifiers with flat gain response; high frequency MMIC Power Amplifiers with high gain and output power; high frequency passive attenuators and filters in small form factors, and standard cell, and structured ASIC and hybrid ASIC designs and manufacturing service for multiple markets offering information technology acquisition review (ITAR) compliance for defense applications. The Company designs and market products that amplifies electrical signals during both the transmission (amplifiers and optical drivers) and reception (TIAs) of optical signals as well as modulate optical signals in the transmission of data.
The Company's optical drivers amplify the input digital data stream that is used to modulate laser light either by direct modulation of the laser or by use of an external modulator that acts as a precise shutter to switch on and off light to create the optical data stream. The Company supplies an optimized component for each type of laser, modulator and photo-diode depending upon the speed, reach and required cost. The Company's microwave and millimeter wave amplifiers amplify small signal radio signals into more signals that can be transmitted over long distances to establish high t! hroughput! data connections or enable radar based applications. The Company's ASIC solutions are used in a number of applications such as defense and test and measurement applications to enable the high speed processing of complex signals.
The Company's product portfolio is designed to cover the range of solutions needed in these different modules. The Company's product portfolio consists of five product lines: GX Series, which includes serial drivers and TIA ICs devices for telecom and data-com markets; HX Series, which includes multi-channel driver and TIA ICs for short reach data-com and optical interconnect applications; LX Series, which includes TFPS modulators for high speed telecom and defense applications; EX Series, which includes amplifiers, filters and attenuators for microwave applications in defense and instrumentation, and CX Series, which includes family of ASIC solutions for custom integrated circuit design.
GX Series
The GigOptix GX Series of products services both the telecom and data-com markets with a broad portfolio of drivers and transimpedence amplifiers that address 10Gbps, 40Gbps and 100Gbps speeds over distances that range from 100 meters to 10,000 kilometers. The GX Series devices are used in FiberChannel, Ethernet, synchronous optical networking (SONET)/ synchronous digital hierarchy (SDH) components and those based upon the optical internetworking forum (OIF) standards.
HX Series
The GigOptix HX Series of products service the high performance computing (HPC), data-com and consumer markets with a portfolio of parallel VCSEL drivers and TIAs that address 3Gbps, 5Gbps,10Gbps, 14Gbps, 16Gbps and 25Gbps channel speeds over 100-300 meters distances in four and 12 channel configurations. The HX Series devices are used in HPC formats, Infiniband, Ethernet and optical high definition multimedia interface (HDMI) components.
LX Series
The GigOptix LX Series of products service the 40Gbps and above telecom! market f! or Mach-Zehnder modulators. The LX Series devices are based on the Company's TFPS EO material technology.
EX Series
The GigOptix EX Series of products leverages the high performance products acquired in the Endwave acquisition. In addition, it also includes the die and design techniques developed for the GX Series telecom and data-com drivers for related defense and instrumentation applications.
CX Series
The GigOptix CX Series of products offers a portfolio of distinct paths to digital and analog mixed signal ASICs with the capability of supporting designs of up to 10M gates in technologies ranging from 0.6 through 65nm. The CX Series uses the Company's technology in Structured and Hybrid ASICs to enable a generic ASIC solution that can be customized for a customer using only a few metal mask layers. The CX Series also offers ASIC services, including Analog and Mixed Signal IP into designs and taking customers designs from RTL or gate-level net list definitions to volume production with third party foundries.
The Company competes with TriQuint, Rohm, InPhi, Centellax, Semtech, Vitesse, M/A-Com, Avago, Emcore, Tyco Electronics, IPtronics. Avago, Emcore, Tyco Electronics, JDSU, Oclaro, Sumitomo, Fujitsu, Emcore, Oclaro, Hittite, Sumitomo, Hittite, RFMD, Northrop Grumman, On -Semiconductor, eSilicon, Open Silicon, Faraday, Toshiba and eASIC.
Advisors' Opinion:- [By Bryan Murphy]
It's admittedly overbought and due for a slight dip thanks to today's surge. But when you take a step back and look at GigOptix Inc. (NYSEMKT:GIG), there's actually a lot to be excited about if you've been mulling a trading in GIG. The trick will be getting the timing right.
Hot Semiconductor Stocks For 2015: Celestica Inc (CLS)
Celestica Inc. (Celestica), incorporated on September 27, 1996, is a provider of supply chain solutions globally to original equipment manufacturers (OEMs) and service providers in the communications, consumer, computing and diversified end markets. The Company has operating network in Americas, Asia and Europe. The products and services it provides serve a range of end products, including smartphones; servers; networking, wireless and telecommunications equipment; storage devices; aerospace and defense electronics, such as in-flight entertainment and guidance systems; healthcare products; audiovisual equipment; printer supplies; peripherals; semiconductor capital equipment, and a range of industrial and green technology electronic equipment, including solar panels and inverters. In June 2011, Celestica acquired the semiconductor equipment contract manufacturing operations of Brooks Automation, Inc. In September 2012, the Company acquired D&H Manufacturing Company. D&H is a manufacturer of precision machined components and assemblies, primarily for the semiconductor capital equipment market.
Celestica offers a range of services, including design, manufacturing, engineering, order fulfillment, logistics and after-market services. The Company uses enterprise resource planning and supply chain management systems to optimize materials management from suppliers through to its customers.
Its global design services and solutions architects are focused on opportunities that span the entire product lifecycle. It also leverages its CoreSim Technology to minimize design revisions. It has developed its Green Services to help its customers comply with environmental legislation, such as those relating to the removal of hazardous substances and waste management/recycling. Its services help the customers design, prototype, introduce, manufacture, test, ship, takeback, repair, refurbish, reuse, recycle and properly dispose of end-of-life (EOL) products. Prototyping is a critical early-stage p! rocess in the development of new products. It uses technologies in the assembly and testing of the products. Its failure analysis capabilities concentrate on identifying the root cause of product failures and determining corrective actions. It has a management system that focuses on continual process improvement.
The Company competes with Benchmark Electronics, Inc., Flextronics International Ltd., Hon Hai Precision Industry Co., Ltd., Jabil Circuit, Inc., Plexus Corp. and Sanmina-SCI Corporation.
Advisors' Opinion:- [By Seth Jayson]
Celestica (NYSE: CLS ) reported earnings on April 23. Here are the numbers you need to know.
The 10-second takeaway
For the quarter ended March 31 (Q1), Celestica met expectations on revenues and beat expectations on earnings per share.
Hot Semiconductor Stocks For 2015: Advanced Semiconductor Engineering Inc (ASX)
Advanced Semiconductor Engineering, Inc. is principally engaged in the manufacture, assembly, processing, testing and distribution of integrated circuits (ICs). The Company provides semiconductor packaging and testing services, including plastic leaded chip carriers (PLCCs), quad flat packages (QFPs) and flip chip packaging technology, among others, which are applied in the manufacture of household electrical appliances, communication devices, automobile components, personal computers, set top boxes, servers, memory integrated circuits (ICs), mobile phones, digital cameras, game consoles, projectors, high definition (HD) televisions, wireless communication network products and power management ICs, among others. The Company operates its businesses primarily in Taiwan, Europe and the Americas. In August 2010, the Company acquired a 100% interest in EEMS Test Singapore.
The Company is focused on packaging and testing logic semiconductors. The Company offers its customers turnkey services, which consist of packaging, testing and direct shipment of semiconductors to end users designated by its customers. The Company�� global base of over 200 customers includes semiconductor companies across a range of end use applications, including Altera Corporation, ATI Technologies, Inc., Broadcom Corporation, Cambridge Silicon Radio Limited and Microsoft Corporation. During the year ended December 31, 2008, the Company�� packaging revenues accounted for 77.7% of its net revenues and its testing revenues accounted for 20.1% of its net revenues.
Packaging Services
The Company offers a range of package types to meet the requirements of its customers, with a focus on packaging solutions. Within its portfolio of package types, the Company focuses on the packaging of semiconductors. These include advanced leadframe-based package types, such as quad flat package, thin quad flat package, bump chip carrier and quad flat no-lead package, and package types based on substrates, such a! s flip-chip ball grid array (BGA) and other BGA types, as well as other packages, such as wafer-bumping products. Leadframe-based packages are packaged by connecting the die, using wire bonders, to the leadframe with gold wire. The Company�� leadframe-based packages include quad flat package (QFP)/ thin quad flat package (TQFP), quad flat no-lead package (QFN)/microchip carrier (MCC), advanced quad flat no-lead package (AQFN), bump chip carrier (BCC), small outline plastic package (SOP)/thin small outline plastic package (TSOP), small outline plastic j-bend package (SOJ), plastic leaded chip carrier (PLCC) and plastic dual in-line package (PDIP). Substrate-based packages employ the BGA design, which utilizes a substrate rather than a leadframe. It also assembles system-in-a-package products, which involve the integration of more than one chip into the same package. The Company�� substrate-based packages include Plastic BGA, Cavity Down BGA, Stacked-Die BGA, Flip-Chip BGA and land grid array (LGA).
The Company�� wafer-level packaging products include wafer level chip scale package (aCSP) and advanced wafer level package (aWLP). The Company offers module assembly services, which combine one or more packaged semiconductors with other components in an integrated module to enable functionality, typically using surface mount technology (SMT) machines and other machinery and equipment for system-level assembly. End use applications for modules include cellular phones, personal digital assistant (PDAs), wireless local area network (LAN) applications, bluetooth applications, camera modules, automotive applications and toys.
The Company provides module assembly services primarily at its facilities in Korea for radio frequency and power amplifier modules used in wireless communications and automotive applications. Interconnect materials connect the input/output on the semiconductor dies to the printed circuit board. Interconnect materials include substrate, which is a multi-layer m! iniature ! printed circuit board. The Company produces substrates for use in its packaging operations.
Testing Services
The Company provides a range of semiconductor testing services, including front-end engineering testing, wafer probing, final testing of logic/mixed-signal/radio frequency (RF) and memory semiconductors and other test-related services. The Company provides front-end engineering testing services, including customized software development, electrical design validation, and reliability and failure analysis. The Company provides final testing services for a variety of memory products, such as static random access memory (SRAM), dynamic random access memory (DRAM), single-bit erasable programmable read-only memory semiconductors and flash memory semiconductors.
The Company provides a range of additional test-related services, including burn-in testing, module sip testing, dry pack, tape and reel, and electric interface board and mechanical test tool design. The Company offers drop shipment services for shipment of semiconductors directly to end users designated by its customers.
Advisors' Opinion:- [By Seth Jayson]
Advanced Semiconductor Engineering (NYSE: ASX ) is expected to report Q2 earnings around July 7. Here's what Wall Street wants to see:
- [By Namitha Jagadeesh]
The FTSE 100 Index (UKX) fell 1.31 points, less than 0.1 percent, to 6,679.77 at 10:12 a.m. in London, trimming an earlier decline of as much as 0.6 percent. The gauge has climbed 13 percent this year as central banks maintained stimulus measures to support the global economy. The broader FTSE All-Share Index (ASX) was also little changed today, while Ireland�� ISEQ Index retreated 0.3 percent.
- [By Adam Haigh]
ASX Ltd. (ASX) posted the biggest weekly loss in 3 1/2 years, falling 6.1 percent to A$33.15, amid a A$553 million ($530 million) capital raising at the operator of Australia�� main stock exchange to ensure its clearing business complies with new regulations.
Hot Semiconductor Stocks For 2015: Dialog Semiconductor PLC (DLG)
Dialog Semiconductor Plc creates integrated, mixed signal integrated circuits (ICs), optimized for personal portable, short-range wireless, lighting, display and automotive applications. The Company operates in three business segments: Mobile Systems, Automotive and Industrial, and Connectivity. The Mobile Systems segment includes its power management and audio chips especially designed to meet the needs of the wireless systems markets and a range of advanced driver technologies for low power display applications - from Passive Matrix Organic Light Emitting Diodes (PMOLEDs), to electronic paper and Micro Electro-Mechanical Systems (MEMS) displays. The Automotive and Industrial segment consists of products, which address the safety, management and control of electronic systems in cars and for industrial applications. The Connectivity segment includes activities, such as short-range wireless, digital cordless and voice over Internet protocol (VoIP) technology. Advisors' Opinion:- [By Jonathan Morgan]
Direct Line (DLG) dropped 2.5 percent to 212.6 pence. RBS sold 300 million shares at 210 pence apiece in its third sale of a stake in the insurance company, according to a statement. The bank, which is majority owned by the U.K. government, reduced its holding in Direct Line by 20 percent to 28.5 percent. RBS slipped 1.3 percent to 364.1 pence.
- [By Corinne Gretler]
Colruyt SA jumped the most in almost a year after reporting earnings that beat estimates. Direct Line Insurance Group Plc (DLG), the U.K.�� biggest home and motor insurer, rallied 3.8 percent after saying it will cut jobs. GSW Immobilien AG, Berlin�� largest residential landlord by market value, advanced 3.8 percent after saying both its chairman and chief executive officer will leave. Mining companies declined as metals fell.
- [By Jonathan Morgan]
Dialog Semiconductor Plc (DLG) surged 6.5 percent to 12.55 euros, its highest price in two months, after Apple Inc. (AAPL), the company�� biggest customer, reported fiscal third-quarter revenue and iPhone sales that beat analysts��estimates.
Hot Semiconductor Stocks For 2015: Solitron Devices Inc (SODI)
Solitron Devices, Inc., incorporated on March 12, 1987, designs, develops, manufactures and markets solid-state semiconductor components and related devices primarily for the military and aerospace markets. The Company manufactures a variety of bipolar and metal oxide semiconductor (MOS) power transistors, power and controls hybrids, junction and power MOS field effect transistors (Power MOSFETS), field effect transistors and other related products. It's products are custom made pursuant to contracts with customers whose end products are sold to the United States government. The Company�� semiconductor products can be classified as active electronic components. The Company�� active electronic components include bipolar transistors and MOS transistors.
The Company�� semiconductor products are used as components of military, commercial, and aerospace electronic equipment, such as ground and airborne radar systems, power distribution systems, missiles, missile control systems, and spacecraft. Its products have been used on the space shuttle and on the spacecraft sent to the moon, to Jupiter (on Galileo) and, to Mars (on Global Surveyor and Mars Sojourner).
Power Transistors
The Company manufactures a variety of power bipolar transistors for applications requiring currents in the range of 0.1 ampere to 300 ampere or voltages in the range of 30 volts to 1000 volts. It also manufactures power diodes under the same military specification. In addition, it manufactures power N-Channel and P-Channel MOSFET transistors and is expanding that line in accordance with customers��requirements.
Hybrids
The Company manufactures thick film hybrids, which generally contain discrete semiconductor chips, integrated circuits, chip capacitors and thick film or thin film resistors. The hybrids are of the high-power type and are custom manufactured for military and aerospace systems. Some of the Company�� hybrids include high power voltage regulators, p! ower amplifiers, power drivers, boosters and controllers. The Company manufactures both standard and custom hybrids.
Voltage Regulators
Voltage regulators provide the power required to activate electronic components such as the integrated circuits. These circuits are found in all electronic devices from radar and missile systems to smart phones.
Field Effect Transistors
The Company manufactures about 30 different types of junction and MOS field effect transistor chips. They are used to produce over 350 different field effect transistor types. The Company�� field effect transistors conform to standard Joint Electronic Device Engineering Council designated transistors, commonly referred to as standard 2N number types. It manufactures both standard and custom field effect transistors.
The Competes with IXYS Corporation, Motorola Inc., International Rectifier, Microsemi Corporation, M.S. Kennedy Corporation, Natel Engineering Company and Sensitron Semiconductor.
Advisors' Opinion:- [By Geoff Gannon] on the amount of stock you can buy and the position size you like. For me, I try not to start buying a stock that I think will never make up 10% of my portfolio. If you don�� mind having 5% positions in your portfolio, your portfolio can obviously be twice as big as mine and you can still consider buying the same small stocks I do. In terms of specific stocks, it depends on the amount of float and the volume the stock trades in an average month. We are really getting into specifics here. And I may be boring people. But if you�� like to hear more about the minutiae of how you actually buy and sell tiny stocks like these, let me know, and I��l do an article on the subject.
By the way, there is a hard and fast rule of thumb that it usually makes no sense to invest in a company with a market cap that is smaller than your portfolio. This is true for both fund and individual investors. Funds break it all the time. But, frankly, it is probably a waste of an analyst/fund manager�� time to even analyze such tiny positions relative to the size of the whole portfolio. Since even when we are discussing very small stocks we are still talking about millions and millions of dollars in market cap, this is hardly a concern for most individuals.
So, for individual investors, actual inability to acquire enough shares of a company to meaningful influence their portfolio is rarely the problem. If you bid for a stock month after month ��you��l get your shares.
The concern for individual investors is not whether buying enough shares is possible. The concern is how quickly and easily you can buy and sell. This is what we call ��iquidity.��/p>
Instead of thinking about stocks as liquid or illiquid, you should think in terms of your portfolio and your liquidity needs. It doesn't make much sense to use what I'll call an "objective" (as in stock-oriented) approach to liquidity rather than a "subjective" (as in investor-oriented) approach to liquidity.
< - [By Geoff Gannon] strong>OPT-Sciences (OPST)
Micropac
Micropac is 76% owned by Heinz-Werner Hempel. He�� a German businessman. You can see the German company he founded here. He�� had control of Micropac for a long-time. I don�� have an exact number in front of me. But I would guess it�� been something like 25 years.
ADDvantage
ADDvantage Technologies is controlled by the Chymiak brothers. See the company�� April 4 press release explaining their decision to turn over the CEO position to an outsider. Regardless, the Chymiaks still control 47% of the company. Ken Chymiak is now chairman. And David Chymiak is still a director and now the company�� chief technology officer. Clearly, it�� still their company.
By the way, the name ADDvantage Technologies has nothing to do with the Chymiaks. Today�� AEY really traces its roots to a private company called Tulsat. The Chymiak brothers acquired that company about 27 years ago. So, effectively, when you buy shares of AEY you are buying into a 27-year-old family-controlled company.
That�� pretty typical in the world of net-nets.
Solitron
Solitron Devices is 29% owned by Shevach Saraf. He has been the CEO for 20 years. The post-bankruptcy Solitron has never known another CEO. Before the bankruptcy, Solitron was a much bigger, much different company. So even though we are not talking about the founder here ��and even though 70% of the company�� shares are not held by the CEO ��we��e still talking about a company where one person has a lot of control. Solitron only has three directors. Saraf is the chairman, CEO, president, CFO and treasurer. Neither of the other two directors joined the board within the last 15 years. So, we aren�� talking about a lot of tumult at the top.
In fact, profitable net-nets seem to be especially common candidates for abandoning the responsibilities of a public company without actually getting taken private.
OPT-Sciences
This
- [By Geoff Gannon]
Solitron (SODI) sells at 74% of NCAV, has decent z- and f-scores, a FCF margin of 5.3% and an ROA of 12%.
Micropac (MPAD) sells at 83% of NCAV, has similar (slightly better) z- and f-scores, a FCF margin of 6%, but has ROA of 28%.
ADDvantage (AEY) sells at 95% of NCAV, has similar (in the ballpark) scores and FCF and ROA of 23%.
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